Conditions For Selecting Cerium Oxide Polishing Powder

1. Material selection for polishing powder.
Etching thinning enterprises usually use cerium oxide rare earth polishing powder for panel and glass thinning.
Due to the different hardness of different materials and the varying chemical properties in water, the usage scenarios are different. Among them, the Mohs hardness of cerium oxide polishing powder is 7. Cerium oxide and silicate glass have high chemical activity and the same hardness, making them suitable for polishing liquid crystal panels and glass. In order to improve the polishing speed of cerium oxide, fluorine is usually added to cerium oxide polishing powder to increase the grinding rate. Low content mixed rare earth polishing powder is usually mixed with 3-8 fluorine; Pure cerium oxide polishing powder is usually not mixed with fluorine. For ZF or F series glass, due to its low hardness and high fluorine content, fluorine free polishing powder is chosen.
2. Particle size of cerium oxide.
The larger the particle size, the greater the grinding force, and the more suitable it is for hard materials. ZF glass should use fine polishing powder. It should be noted that all cerium oxide particles have distribution issues. The size of the average particle size or medium diameter D50 only determines the polishing speed, while the larger particle size DMAX determines the polishing accuracy. Therefore, in order to achieve high precision requirements, the particles of polishing powder should be controlled.
3. Hardness of polishing powder.
The true hardness of polishing powder is related to the material, such as a Mohs hardness of about 7, similar to various cerium oxides. But different cerium oxides give people different hardness because cerium oxide polishing powder is usually an agglomerate. Due to different combustion temperatures, the strength of agglomerates also varies, resulting in different hardness sensations when used. Of course, some polishing powders add alumina and other hard materials to improve grinding rate and wear resistance.
4. Concentration of polishing slurry.
The concentration of the slurry during the polishing process determines the polishing speed, and the higher the concentration, the higher the polishing speed. When using small particle polishing powder, the slurry concentration should be appropriately reduced to obtain appropriate fluidity.
5. Selection of polishing molds.
The polishing mold should be a bit soft. It should be pointed out that many polyurethane polishing pads have added cerium oxide polishing powder. The large particle size of these polishing powders also determines the polishing accuracy.